Responsibilities：
1.Responsible froutine PCB layout designs.
2.Work close with hardware/process engineers to ensure circuit process requirements are well defined incorporated the board design.
3.Generate documents per design flow rules, submit fpeer review attach to file system after that.
4.Actively participate in technical discussions at the early design phase.
5.Review verify the layout designs per the checklist fothers.
6.Work close with PCB suppliers to make a "buildable" PCB/Flex, participate in DFM replies fsome special cases.
Requirements：
1.BS higher in electrical engineering equivalent.
2.8+ years multilayer board design experience with RF, mixed-signal circuit HDI, familiar with blind/buried vias application, capable of implementing guidelines design.
3.In Depth knowledge of High-Density Interconnect (HDI), substrate design its associated design rules.
4.Ability to derive a balanced design to satisfy manufacture ability project goals such as performance & density.
5.At least as an expert in one of PCB design tools, MentPads design experience Allegro is preferred.
6.Experience on PCB post-processing tools like CAM350, AutoCAD, BluePrint is preferred.
7.Know of rigid board manufacturing process, like Tenting, m-SAP extended knowledge of FPC manufacturing is a plus.
8.Self-motivated, hard-working, capable of completing assignments under the pressure of urgent schedule high design requirements.
9.Good English communication skill.
