Job Responsibilities:
● Be familiar with circuit diagrams design requirements, complete the device packaging design in accordance with the component manual.
● Based on the product structure, define the board frame laminates, complete the layout routing design of the PCB, ensure that the design meets the functional, performance reliability requirements.
● Responsible fthe analysis optimization of high-speed signals, power integrity, signal integrity, conducting EMC/EMI design to ensure that products meet electromagnetic compatibility requirements.
● Be responsible fthe thermal analysis thermal design of PCBS to ensure that the products meet the heat dissipation requirements.
● Conduct Layout checks in accordance with design specificationsganize PCB design reviews.
● Work with hardware engineers to complete Layout reviews, issue corrections, version iterations.
● Be responsible fthe output of production materials such as Gerber files, coordinate files, BOM, surface mount files.
● Confirm the issues related to the products production launch have technical communication with the supplier.
● Follow up on relevant issues during the PCB prototyping, soldering trial production processes.
● Assist hardware engineers in completing prototype debugging, BOMganization production issue analysis.
● Participate in DFM, DFT DFA reviews to ensure that the design is manufacturable, testable assembly.
● Be responsible fthe establishment maintenance of the PCB packaging library component library.
● Prepare relevant documents such as PCB design specifications design reports, archive PCB design files, ensure design traceability.
Job Requirements:
● Bachelors degree above, majoring in electronic engineering, communication engineering, automation related.More than 5 years of PCB Layout design experience.
● Proficient in using PCB design software such as Altium Designer, Cadence Allegro PADS so on.
● Familiar with PCB packaging manufacturing, layout routing rules, Gerber output PCB production processes.
● Familiar with common PCB processes, including multi-layer board lamination, impedance control, BGA, QFN, LGA other packaging routing.
● Proficient in high-speed digital circuit design, with experience in ARM SoC, DDR, FPGA, Gigabit Ethernet design, a grasp of high-speed signal routing principles.
● Possess solid mixed-signal design capabilities optimize the design fboth analog digital circuits.
● Understthe principles of signal integrity power supply integrity, be capable of independently handling power tree design signal return path issues.
● Understthe thermal design thermal analysis of PCBS be capable of independently considering the heat dissipation requirements of PCBS.
● Familiar with IPC standards EMC/EMI design specifications, effectively carry out anti-interference design to meet safety regulations.
● Familiar with DFM (Design fManufacturability), DFT (Design fTestability) DFA (Design fAssembly).
● Design experience in communication equipment, optoelectronic instruments, medical devices, industrial control products is preferred.
● Have PCB simulation experience be proficient in using simulation tools such as Sigrity HyperLynx.
● Possess excellent communication skills a strong sense of teamwork, capable of closely collaborating with teams specializing in hardware design, structural design, etc., maintaining close communication with manufacturers.
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