申才科技 ee 在哪些城市有办公地点？ 主要分布如下：成都占100%，想知道其他城市分别占比多少？请点击该模块查看，统计依赖近一年招聘职位，仅供参考。
申才科技 ee 历年需求趋势
申才科技 ee 历年招聘量变化
申才科技 ee 是做什么的
取自申才科技近一年相关招聘职位
Flip Chip Packaging SeniEngineer 倒装芯片封装高级工程师
成都 |
3-5年 |
本科以上 |
2026-04-11
25-40k·13薪
Responsibility
Partner with the business unit design team to develop flip chiinterconnect assembly packagingtechnologies solutions frondesign, prototyping product qualification to meet technology ancproduct roadmaD与BU 团队设计小组沟通倒装焊工艺及产品结构设计，寻求合适的解决的方案以支持BU新产品开发计划
Cross-functionalteams collaboration.engagement withresearcinstitutions, tool material suppliers in supporting product qualificationinnovate interconnect/packaging materials solution to enhance produoreliability performanc跨职能团队合作，与研究机构，工具和材料供应商合作，支持产品认证，创新互连/封装材料解决方案，以提高产品的可靠性和性能。
- Establish robust process margins, inline SPC controls with good Cp/Cplperformance in productio建立稳健的工艺控制，在线SPC控制，并使量产过程具有良好的Cp/Cpk性凶
Provide documentation (characterization reports, operating instructionscontrol plan, etc)& regular technical reporting coordinate internalexternally to fulfil the Technology Product Developmerproaram提供文件支持(特性报告，操作指导书，控制计划等)，并协调内部和外部完成技术和产品开发计划
Perform analysis on process performance (yield /manufacturing coscycle-time) control, establish design rule对工艺性能，良率分析，制造成本和生产周期控制,以及建立相应设计规DUServe as a technical team member a subject matter expert
Job Requirements
教育背景Education Backqround-PhD/Master/BSc/BEng in Material Science, Chemical. Polymer ScienceChemistry. Physics5lecticalMechanical Engineeing:电子、半导体器件物理及相关专业
Experience with flip chip assembly bumpconstructure desiarencompassing interconnections at various levels(chip, package, ancPCB)具有倒装焊及铜柱连接结构设计经验，包括不同级别(芯片，封装和PCB的互连
工作经验Working Experience
-Priwork experience in new product and/new process developmenind qualification; experience in assembly processing, Interconnect assemblwith experience in Flip chip, thermocompression bonding, underfill will ban advantage有新产品和/或新工艺开发和认证的工作经验;具有封装经验，具有倒装芯H。热压键合和底填充的互连组装经验将优先者虑
