cpo岗位职责

1. 学历与专业：硕士及以上学历，光学工程、微电子、通信工程、材料科学等相关专业，3年以上CPO/光互连/先进封装领域工作经验。
2. 技术能力：
- 精通光互连架构设计，熟悉插入损耗预算、工艺就绪度评估及技术路线规划；
- 掌握光子集成电路（PIC）、光纤阵列（FAU）、微透镜、光波导等关键组件的机械/光学规格制定；
- 具备亚微米精度光接口连接工艺开发经验，了解主动对准系统、纳米定位算法及多轴计量技术；
- 熟悉激光直写技术在玻璃光波导中的应用，以及光纤阵列、微透镜被动贴装的量产工艺开发。
3. 项目经验：有24通道及以上多PIC CPO封装项目经验，或主导过高带宽光互连相关量产工艺开发优先。
4. 软技能：具备跨团队协作能力，能与设备厂商、组件供应商高效配合；有较强的问题分析与解决能力，可独立推进技术攻关。

1. 承担先进封装项目，设计1.6T/3.2T CPO光引擎，包括光引擎设计和仿真，电芯片和硅光芯片2D/3D共封装，光纤-芯片耦合封装等；
2. 优化光芯片和电芯片的共封装设计，从设计和实现上保证光引擎的性能和可靠性；
3. 从事热设计和仿真，分析光、电芯片的散热方案，并解决共封装光引擎的热管理问题；
4. 从建模和仿真出发，设计、表征、验证和优化共封装制造工艺；
5. 开发和实现共封装工艺，在保证性能和质量的前提下，持续改进封装工艺以降低成本
6. 制定共封装和光引擎测试方案，对测试数据进行处理和分析；
7. 与跨职能、跨部门团队合作，解决光耦合、共封装和光引擎的技术挑战.
任职要求：
1. 光学工程、光电子、物理电子学等相关专业，硕士及以上学历，2年以上共封装和光引擎设计开发经验；
2. 对光耦合、电信号完整性和散热设计有深入的理解和设计能力，能够熟练使用仿真工具进行光引擎的光、电和热仿真，具备异质集成器件设计经验者优先；
3. 熟悉光、电芯片封装工艺，具备设计、实现并优化光电共封装工艺的能力；
4. 掌握共封装和光引擎的测试技能，包括电芯片、光芯片、耦合封装，信号完整性以及光引擎的各项性能指标；
5. 工作认真负责，具有良好的沟通能力与团队协作能力。

职责描述：
Equipment repair maintenance 40%
•Achieve monthly equipment availability in line with KPI targets.
•Achieve monthly equipment downtime targets in line with KPI requirements.
•Achieve monthly equipment maintenance completion rate in line with KPI targets.
•Complete repair reports in compliance with KPI requirements.
Equipment problem solving 20%
•Resolve equipment-related production capacity issues in a timely manner.
•Collaborate with the workshop to address product quality issues caused by equipment.
•Resolve equipment safety hazards issues.
•Address close findings from QA audits.
New equipment installation, debugging acceptance 15%
•Arrange relocation of new equipment to designated locations coordinate connection of utilities including water, electricity gas.
•Coordinate with equipment vendors on performance verification production debugging.
•Develop maintenance operation SOPs fnew equipment.
•Complete issue new equipment acceptance reports.
Equipment performance safety improvement 15%
•Submit a monthly report identifying potential safety hazards.
•Submit monthly continuous improvement proposals.
•Submit an annual engineering improvement report.
Equipment failure data analysis reporting 10%
•Conduct quarterly equipment failure analysis issue improvement reports.
•Revise maintenance content plans, implement programs to meet performance targets.
•Submit daily work reports.
任职要求：
•College degree above in Mechatronics, Electrical, Mechanical related field.
•Proficient in written spoken English.
•3–5 years of experience in semiconductequipment maintenance repair.
•Experience in process improvement equipment-related problem-solving.
•Thorough understanding of equipment mechanical electrical working principles.
•Proficient in equipment database operation management.
•Familiar with office software design tools such as CAD SolidWorks.
•Strong customer-oriented mindset excellent planningganizational skills.
•Comprehensive problem analysis resolution skills, innovative thinking strong teamwork spirit.