Summary:
Monitdevelop supplier quality with best TQRDC (Technology, Quality, Response, Delivery Cost) performance. 监控和提高封装厂在技术，质量，反馈，交期以及成本方面的表现。
RESPONSIBILITIES:
1. Handle assembly quality issue, verify the root cause make sure the corrective actions can be implemented effectively timely to prevent recurrence. 处理封装质量事故，查找原因并协助封装供应商制定和实施有效改进措施，预防同类事故再次发生。
2. Conduct regular audit have the quarterly performance rating, discuss quality/technical issues with suppliers to support them on continuous improvement provide reliable product. 完成定期对封装供应商的审查和季度的评分，并与其探讨以提升质量及技术，协助他们制定长期有效的改进措施以提供高质量产品。
3. Weekly monitanalyze the assembly yield, defect mode, SPC to assure ongoing quality system capability, daily check the assembly WIP to ensure the short assembly cycle time on time delivery. 每周监控和分析封装良率、废品模式、SPC等以确保可靠的产品质量，每天查看封装供应商在线产品的状况以缩短产品封装周期，保证准时交货。
4. Conduct the risk assessment have the disposition fwafer incoming issue at supplier on hold lot with assembly issue at test floor. 完成对风险产品的评估，处理在封装供应商处芯片来料问题及测试线因封装问题而被扣留的产品。
5. Generate evaluate supplier quality reports, establish appropriate baseline, determine continuous improvement opportunities. 完成对封装供应商的评估报告以及制定各种封装特殊要求，提出需持续改进的地方。
6. Coordinates with FA engineers to indentify the assembly failures, addresses the root cause get the corrective actions with assemblers. 协助FA工程师分析封装失效废品，找到失效原因并与封装供应商一起提出解决措施。
7. Coordinates the qualification of new supplier, materials, package, assembly processes. 协助对各种新封装供应商、封装材料、封装模式、封装流程等的评估。
REQUIREMENTS:
1. Bacheldegree, majoring in Engineering related discipline. 本科及以上学历，工程或相关专业。
2. Familiar with general assembly processes QA controls (8D CAR, FMEA, SPC, etc). 掌握封装流程以及各种质量管控分析方法。
3. Knowledge of basic concepts of FA reliability. 了解基本的失效分析以及可靠性知识。
4. Fluent English writing speaking skills. 流利的英文书写以及口语。
