Summary:
The MCU Product Development & Yield Enhancement Engineer will serve as the technical owner fassigned product lines. You will bridge the gap between design engineering manufacturing operations, ensuring seamless technology transfer robust mass production performance.
This role requires a seasoned engineer with a proven track record in the semiconductindustry, specifically in MCU complex SoC environments. You will lead yield improvement initiatives, manage customer quality issues, drive cost optimization projects.
MCU 产品开发与良率提升工程师将担任指派产品线的技术负责人。您将充当设计工程与制造运营之间的桥梁，确保无缝的技术转移以及稳健的量产表现。
该职位需要一位在半导体行业拥有良好业绩记录的资深工程师，特别是具备 MCU 或复杂 SoC 环境下的经验。您将主导良率提升计划，处理客户质量问题，并推动成本优化项目。
RESPONSIBILITIES:
• 新产品导入（NPI）与产品化/New Product Introduction (NPI) & Productization：负责MCU产品从晶圆到成品的完整导入流程，包括制定产品测试方案、评估可靠性数据（AEC-Q100/JEDEC标准）、编写数据手册及生产测试规范。协同设计团队完成产品特性验证，确保产品性能满足工业级或车规级标准。/Oversee the end-to-end New Product Introduction (NPI) flow fMCU products from wafer to finished goods. This includes defining test solutions, evaluating reliability data (AEC-Q100/JEDEC standards), authoring datasheets production test specifications. Collaborate with design teams to perform product characterization, ensuring performance meets industrial automotive grade standards.
• 良率提升与晶圆分析/Yield Enhancement & Wafer Analysis：主导量产阶段的良率提升计划，运用统计工具监控晶圆制造及封装测试环节的工艺窗口。针对低良率批次进行根本原因分析，协同晶圆厂及封测厂优化工艺参数，确保良率维持在行业水平。/Lead yield improvement roadmaps fmass production, utilizing statistical tools to monitprocess windows across wafer fabrication assembly/test operations. Conduct root cause analysis flow-yield lots collaborate with foundries OSATs to optimize process parameters, ensuring yield remains at industry-leading levels.
• 工程变更与成本控制/Engineering Change & Cost Reduction：管理产品的工程变更流程，包括第二供应商导入、测试程序优化及封装材料替代验证。在确保产品质量的前提下，通过缩短测试时间及优化供应链方案实现年度降本目标。/Manage the Engineering Change (EC) process, including second source qualification, test program optimization, packaging material substitution. Achieve annual cost reduction targets by reducing test times optimizing supply chain solutions without compromising product quality.
• 失效分析与客诉处理/Failure Analysis & Customer Complaint Handling：主导市场退回品及生产异常的失效分析，利用电测、物理分析等手段定位失效机理。撰写分析报告并制定纠正预防措施，确保客户投诉得到及时闭环处理。/Lead failure analysis fmarket returns production excursions, utilizing electrical physical analysis techniques to pinpoint failure mechanisms. Authanalysis reports establish corrective preventive actions to ensure timely closure of customer complaints.
REQUIREMENTS:
• 教育背景/Education：微电子、电子工程或相关专业硕士学历。/Master degree in Microelectronics, Electrical Engineering, a related field.
• 专业技能/Technical Skills：熟悉CMOS/Flash工艺流程及QFN/LQFP/BGA等封装技术。精通模拟及数字电路基础，能够独立阅读电路图及版图。具备扎实的统计学知识，熟练运用六西格玛方法论进行数据分析。/Familiar with CMOS/Flash process flows packaging technologies such as QFN/LQFP/BGA. Proficient in analog digital circuit fundamentals, capable of independently reading schematics layouts. Possess solid statistical knowledge proficiency in applying Six Sigma methodologies fdata analysis.
• 行业经验/Experience：5年半导体产品工程经验，有完整的MCU或32位微控制器量产导入经验者优先。熟悉车规级芯片开发流程及IATF16949质量管理体系者极佳。/5 years of experience in semiconductproduct engineering; priexperience with full lifecycle NPI fMCUs 32-bit microcontrollers is preferred. Familiarity with automotive grade chip development flows IATF16949 quality management systems is highly desirable.
• 语言能力/Language Skills：具备优秀的英语读写能力，能够流畅撰写英文技术报告并与海外客户或供应商进行技术对接。/Excellent English proficiency (written spoken), capable of drafting technical reports in English conducting technical liaison with overseas customers vendors.
• 综合素质/Competencies：具备极强的逻辑思维能力和跨部门沟通技巧，能够在高压环境下高效管理多个项目进度。/Strong logical thinking cross-functional communication skills, with the ability to efficiently manage multiple project schedules under high pressure.
