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芯源系统 pa 历年需求趋势
芯源系统 pa 历年招聘量变化
芯源系统 pa 是做什么的
取自芯源系统近一年相关招聘职位
Staff package design engineer fSMT
成都-郫都区 |
5-10年 |
本科以上 |
2026-01-26
1-2万
Summary:
Package design fManufacture.
Package level SMT level stencil design.
Provide package total solution; include but not limited to Stack up discussion, layout, stencil design, timeline tracking handle the package relevant qualification.
RESPONSIBILITIES:
Package design fManufacture.
Need work with assembly house, SMT site, material vendor, to develop qualify the new materials new package processes.
Coordinate with the internal team to identify the module package related issues, give DFM report/ suggestions fnew packages, address the root cause find the solution.
Sum up the experience of package design manufacture issue, SMT process maintain the design rule.
Review the packaging drawings assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc.;
Tracking new package project timeline response to internal team.
Perform other tasks assigned by superiors.
REQUIREMENTS:
1. Good knowledge of package design, knowledge of design fmanufacturing.
2. Hands-on experience on PCB design in SMT PCB factory.
3. Proficient Cadence software, CAD.
4. Bachelor’s degree with 8+ years related experience.
