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取自芯源系统近一年相关招聘职位
Module Embedded Package Design Engineer
成都-郫都区 |
5-10年 |
本科以上 |
2026-04-02
1-2万
Summary:
Provide Embedded Package design total solution; include but not limited to Stack up discussion . ECP module design, layout, development, timeline tracking handle the module relevant qualification.
RESPONSIBILITIES:
Embedded substrate PCB layout fModule projects.
Need work with Substrate/PCB vendor, assembly house, SMT site, material vendor, to develop qualify the new materials new package processes.
Coordinate with the internal team to identify the module package related issues, giving report/suggestions fnew packages, address the root cause find the solution.
Sum up the experience of Embedded package design, SMT maintain the design rule.
Review the packaging drawings assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc;
Tracking new module PKG timeline response to internal team.
Perform other tasks assigned by superiors.
REQUIREMENTS:
1. Hands-on experience on substrate design in Substrate/PCB factory.
2. Be Proficient Cadence software. AutoCAD.
3. Good knowledge of Embedded packages design rules manufacture processes/ issues
4. Bachelor’s degree with 5+ years related experience.
KEY WORDS:
Embedded Substrate layout,CAD
Package designer Standard, CAD, substrate manufacture experience
