芯源系统 sem 招聘（工资待遇要求）

Summary:
Provide power module package/assembly total solution; include but not limited to module design review, assembly process development, DFA/TRA , driving Sub-con NPD&NPI MP continues improvement, Sub-con survey/management/performance review etc.
提供电源模块封装/制造整体解决方案；包括但不限于模块设计审查、封装工艺评审和新技术开发、技术风险评估、推动代工厂新产品开发/导入/量产品持续改善、代工厂开发/管理/绩效评估，等等。

RESPONSIBILITIES:
1.Power module process design rule roadmap development, new material/Tech survey introduction.
电源模块制程设计规则和路线图开发,新材料/技术导入。
2.Based process design rule review the module design manufacturability assure them to meet the process design rules/machine capability/high quality/low cost.
根据制程设计规范评审模块设计可制造性，确保其符合设计规则，设备能力、高质量、低成本。
3.DFA/TRA review of power module designs.
根据代工厂设备和制程能力负责对电源模块设计进行DFA/TRA审查。
4.Work with design team, Sub-con, material vendto develop qualify new materials new assembly processes.
与设计团队、封装厂、材料供应商合作，开发和导入新材料和新的封装工艺。
5.Coordinate with internal team to identify the module package related issues, addresses the root cause find the solution.
通过协调内部资源分析模块相关问题，及时解决根本原因并找到解决方案。
6.Sub-conmanagement including NPI/MP continues improvement/capacity expansion/on-time delivery/cost down plan.
作为代工厂负责人负责推动代工厂新产品开发、量产品持续改善、产能扩张、准时交货、降本计划、等代工厂管理。
7.Sum up the experience of module package design, process design rule, lesson learnt，BKM.
总结模块封装设计、制程工艺设计规则、生产经验教训、经验、等等。
8.Perform other assigned tasks as needed.
领导安排的其他工作

REQUIREMENTS:
1.Hands on experiences on PCBA/OSAT,PCB/Sub design,process development/MP continues improvement/quality management;
具有在 PCBA或半导体封测工厂进行 PCB/基板设计、制程开发、量产品持续改善、质量管理的实际经验。
2.Familiar with AutoCAD, PCB Designer Standard, CAM350 Cadence software;
熟悉 AutoCAD 、 PCB Designer Standard、CAM350 或 Cadence 软件。
3.Good knowledge of SMT,FC, Underfill, Mold,laser cutting,strip grinding PCB process;
熟悉 SMT、倒装芯片、点部填充、塑封、激光切割、整板研磨 和 PCB制程工艺。
4. Bacheldegree above more than 5 years of relevant work experience;
本科以上学历并有5年以上相关工作经验。