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Module package design engineer
成都-郫都区 |
5-10年 |
本科以上 |
2025-07-28
12000-20000
Summary:
Provide module package total solution; include but not limited to Stack up discussion, module design, layout, development, timeline tracking handle the module relevant qualification.
RESPONSIBILITIES:
1. PCB substrate layout fModule projects.
2. Need work with PCB vendor, assembly house, SMT site, material vendor, to develop qualify the new materials new package processes.
3. Coordinate with the internal team to identify the module package related issues, giving DFM report/ suggestions fnew module packages, address the root cause find the solution.
4. Sum up the experience of module package design, SMT process maintain the design rule.
5. Review the packaging drawings assure them to meet package design rules, including package outline, build kit, lead frame drawing, bump mask drawing, etc.;
6. Tracking new module PKG timeline response to internal team.
7. Perform other tasks assigned by superiors.
REQUIREMENTS:
1. Hands-on experience on PCB design in SMT PCB factory.
2. Proficient Cadence software. AutoCAD.
3. Having AD PCB Designer Standard, CAM350 software experience will be better.
4. Good knowledge of SMT PCB process, design rules
5. Bachelor’s degree with 5+ years related experience.
