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芯源系统 ka 历年需求趋势
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取自芯源系统近一年相关招聘职位
Principal Package Developing Engineer
成都-郫都区 |
5-10年 |
本科以上 |
2026-03-28
1.5-3万
RESPONSIBILITIES:
1. Develop new package type package structure
2. Survey new material to meet new package process, reliability, cost requirements
3. Collect packaging information/requirement from TME/DE/Marketing/Competitfnext generation package development
4. Work with assembly house material vendto develop qualify the new material new package
5. Provide the technical support to DE/TME groups fpackage definition, selection, cost analysis
6. Sum up the experience of package design & process, maintain package design rule & package road map
7. Perform other tasks assigned by supervisor
REQUIREMENTS:
1. Intensive hands-on experience on new package introduction/development
2. Good knowledge of package development principles
3. Knowledge about semiconductsupply chain, familiar with assembly sub-contractors, packaging material vendors
4. Fluent in spoken written English
5. Familiar with AutoCAD Cadence software is a plus
6. Bachelor/master’s degree with 10+ years direct related experience, Doctdegree with 5+ related experience
