Job Description
Role Responsibilities:
Lead advanced packaging process engagements with China based customers, establishing trusted technical partnerships translating customer requirements FabVantage value added solutions
Identify, analyze, resolve high value process and/integration issues using FabVantage methodologies, advanced data analytics, AI enabled tools (JMP, FSS, AIx)
Define implement best practices fadvanced packaging modules, enabling service opportunities in support of AGS sales initiatives
Drive knowledge capture by documenting findings, writing technical reports, delivering presentations to internal stakeholders customers
Utilize techniques, define methods, apply new technologies to characterize hardware, and/perform hardware characterization on complex systems
Develop, plan, execute process engineering projects, within safety guidelines
Communicate engage with customers to resolve a broad spectrum of complex process engineering issues, with limited supervision
Minimum Qualifications:
Bachelor’s Master’s degree in Engineering, Materials Science, related disciplines.
5+ years above of experience in the semiconductpackaging industry.
Hands‑on experience in advanced packaging process strongly preferred.
Demonstrates conceptual practical expertise in complex problem solving
Additional Job Description
Location: Shanghai/Hangzhou/Hefei/Nanjing/Suzhou/Wuxi
Required Skills & Expertise:
Familiar with semiconductbackend packaging processes, expertise in CMP and/Etch would be plus, knowledge on HBM, 2.5D/3D pkg, high‑density interconnects strongly preferred
Strong proficiency in data analytics, DOE, statistical analysis tools (such as JMP & Applied Pro); experience with AIx databases digital FabVantage platforms preferred
Proven ability to solve complex process problems, perform rigorous root cause analysis, deliver sustainable improvements.
Excellent communication technical presentation skills
Demonstrated effectiveness in customer‑facing, cross‑functional environments with measurable business impact